Silicon Wafer Lapping Machine

Product Details

Equipment Use:

The silicon wafer lapping machine is mainly used for lapping and polishing silicon wafer or quartz wafer.

Also widely used in optical crystal, optical glass, lithium niobate, potassium arsenide, ceramic sheet and other thin brittle metal or non-metal lapping or polishing.

Equipment Features:

1, AC frequency conversion motor drive, soft start, soft stop, stable and reliable.

2, The oil pressure lifting gear ring, very stable, the sun wheel under the shim can adjust the position, the effective use of gear ring and the sun wheel.

3, The upper plate is provided with a slow descending cylinder, which not only effectively prevents the breakage of thin and brittle workpieces, but also can be independently controlled by pressure.

4, By using electronic preset counter, the number of lapping turns and requirements can be accurately controlled.

5, Can be used to repair the lapping plate.

6, Can be connected with ALC (frequency monitor).

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